• Process-safe handling of printed circuit boards and drilled PCBs
  • Simple separation of intermediate layers during loading and unloading of wet process equipment (e.g. final cleaning)
  • Use in the handling of inner layers for multilayers
  • Low-contact gripping of sensitive workpieces such as thin copper foils and substrates
  • Gentle handling of workpieces with slightly structured surfaces
Product Highlights
  • Operation without ejector due to integrated vacuum generation according to the Bernoulli principle
  • Low-contact handling due to "floating" suction cup on an air cushion
  • High leakage compensation thanks to high flow rate at low vacuum
  • Safe separation of thin, porous workpieces
  • Protection against uncontrolled electrostatic discharge by elastomer buffer made of NBR-ESD
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