- Process-safe handling of printed circuit boards and drilled PCBs
- Simple separation of intermediate layers during loading and unloading of wet process equipment (e.g. final cleaning)
- Use in the handling of inner layers for multilayers
- Low-contact gripping of sensitive workpieces such as thin copper foils and substrates
- Gentle handling of workpieces with slightly structured surfaces
Product Highlights
- Operation without ejector due to integrated vacuum generation according to the Bernoulli principle
- Low-contact handling due to "floating" suction cup on an air cushion
- High leakage compensation thanks to high flow rate at low vacuum
- Safe separation of thin, porous workpieces
- Protection against uncontrolled electrostatic discharge by elastomer buffer made of NBR-ESD